The University of Waterloo team investigated the redesign of a heat sink for cooling central processing units (CPUs). The new heat sink features an organic, branched fin design revolved around a circular base which is situated on top of the CPU. It will be part of an assembly with a fan mounted above the heat sink to facilitate forced convection, making it an active heat sink system.
Outstanding Young Manufacturing Engineer Award Recipients
Designed is a thermally efficient phone case targeted towards users who care about battery life. There is a growing market for phone cases and an increasing need for users to save battery life and increase phone performance.
Changing the Face(s) of Manufacturing
Personalized Manufacturing: Psychology and Sociology as Fundamental Design Elements in Future Advanced Production Systems
Runner-Up of 2021 Aubin Case Study Award
Next-Generation Materials: Government presented by Hilmar Koerner, AFRL, at Aerospace Composites Forum on July 19, 2022.