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The Copper Cooler: Heat Sink for CPUs (PDF)

The University of Waterloo team investigated the redesign of a heat sink for cooling central processing units (CPUs). The new heat sink features an organic, branched fin design revolved around a circular base which is situated on top of the CPU. It will be part of an assembly with a fan mounted above the heat sink to facilitate forced convection, making it an active heat sink system.

2019 SkillsUSA Complete Challenge Guide (PDF)

Additive manufacturing/3D printing is changing the way things are made. From the rapid prototyping lab all the way to the manufacturing floor. Companies in the automotive, aerospace and consumer goods industries are leaning into an era of Industry 4.0, a technological playing field where additive augments other technologies like robotics to provide higher throughput.