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2024 Digital Manufacturing Challenge Undergraduate Runner-Up

2020 NAMRI Award Program

The University of Waterloo team investigated the redesign of a heat sink for cooling central processing units (CPUs). The new heat sink features an organic, branched fin design revolved around a circular base which is situated on top of the CPU. It will be part of an assembly with a fan mounted above the heat sink to facilitate forced convection, making it an active heat sink system.

Tech Comm23 Pillar 3 (PDF)

So you want to be a Welder (PDF)

Novel bio-inspired electrode design for affordable green hydrogen production

Next-Generation Materials: Government presented by Hilmar Koerner, AFRL, at Aerospace Composites Forum on July 19, 2022.

Industry 4.0 presented by Avner Ben-Bassat, Plataine, at Aerospace Composites Forum on July 20, 2022.